Tvr Srl - Circuiti stampati di alta qualità

Standard Specifications

Delivery time

3gg 2layer; 5gg multilayer

PCB size

570x430 mm

Layers number

1-10

PCB thickness

0.8 to 3.2 mm

Min. lines/spaces

100 µm

Min. drill diameter

0.2 mm

Aspect ratio

8 : 1

Certificate of compliance

Issued each supply

Metallographic section

Internal of each batch

Impedance control

Advanced

Delivery time

1gg 2 layer; 2gg multilayer

PCB size

600x500 mm

Layers number

Up to 64

PCB thickness

0.05 to 7mm

Min. lines/spaces

40 µm

Min. drill diameter

0.075 mm

Aspect ratio

22 : 1

Certificate of compliance

Issued each supply

Metallographic section

Certification and delivery of specimen

Impedance control

+ / - 5% with Certification

Special Technologies

High Number of Layers
Blind and Buried Vias
Vias-on-pad and Hole Plugging
Flexible and Rigid-Flex Circuits
Backdrilling
Backplanes
HDIs

TVR has a production capacity ranging from 25 to 40 different boards per day, over 500 per month and more than 5000 per year.

The production mix is made up of samples and small series, all made in our factory without foreign trading.

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Surface Finishes

HAL LF

Lead-Free

In this surface finish, the panel is vertically dipped into a bath of molten solder composed of tin and copper, ensuring that all exposed copper surfaces are covered by the solder. The PCB is then dried with compressed air to remove any excess solder. This type of surface finish provides good durability and reliable soldering.

HAL Pb

Tin-Lead

The process is similar to the HAL LF finish, but in this case, the PCB is dipped into a bath of tin and lead and then dried with hot air jets to remove excess alloy from holes and pads. This finish offers good durability and excellent solderability.

ENIG

Chemical Gold

Also known as immersion gold, ENIG is a chemical process that involves depositing a layer of nickel and a layer of gold onto the board, with the gold layer protecting the underlying nickel. The benefits of ENIG include excellent solderability and corrosion resistance.

ENEPIG

Electroless Nickel Electroless Palladium Immersion Gold

ENEPIG is an immersion chemical process similar to ENIG. In addition to nickel and gold, ENEPIG has an extra layer of palladium that acts as a barrier, preventing the gold from diffusing into the nickel layer. This finish offers excellent oxidation properties and good wettability.

Hard Gold

Electrolytic Gold

This is an electrolytic process in which a layer of nickel is first applied to the panel, followed by a layer of gold. The thickness of the gold layer provides good durability and longevity.

Immersion Tin

Chemical Tin

Tin chemical or tin immersion is a metallic surface finish deposit. The board is immersed in a chemical tin bath, which improves its solderability. Tin plating has excellent planarity characteristics and good durability.

Immersion Silver

Chemical Silver

This is a chemical process in which a uniform layer of silver is deposited on the circuit, ensuring excellent solderability. This finish provides significant resistance to oxidation.